Application

Conductive materials

Silver paste

Used for IC chip bonding. It consists of silver particles and a binder. Because the ratio of silver is high, redispersion is necessary before use.

Silver paste

Material Silver paste
Capacity 20g
Unit THINKY MIXER ARV-310
Operation time setting 2000rpm 30sec 
Compounding ratio 60wt%
Material Viscosity 150 Pa・s
Specific gravity 2.5

Related data

  • Before

    Before

  • After

    After

Supported products

THINKYMIXER (Vacuum) ARV-310

・Simultaneous mixing, dispersion, and submicron-level air bubble elimination
・Deaeration of high-viscosity materials difficult to be processed by a centrifugal separator
・Reduced processing time and improved deareation performance compared to the atmospheric type mixer
・Centrifugal force of revolution prevents overflow of material during operation
・High-specific-weight materials such as fluorescent material can be evenly dispersed and deaerated without sedimentation (ARV-310LED)
・CE certified model is available

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Nanomaterial applications

Glasses

Pharmaceuticals

Dental Materials

Others