Conductive materials
Silver paste
Used for IC chip bonding. It consists of silver particles and a binder. Because the ratio of silver is high, redispersion is necessary before use.
| Material | Silver paste |
|---|---|
| Capacity | 20ｇ |
| Unit | THINKY MIXER ARV-310 |
| Operation time setting | 2000rpm 30sec |
| Compounding ratio | 60wt％ |
| Material Viscosity | 150 Pa・s |
| Specific gravity | 2.5 |
Related data
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Before
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After
