User’s dilemma: Case
Issues with variation and efficiency
We manufacture and sell compound semiconductors.
One of the manufacturing processes for compound semiconductors is resin molding. This involves pouring blended, mixed, and defoamed resin into semiconductor packages, and then hardening it in an electric furnace.
In the past, we manually mixed resin using a spatula and then defoamed it by using a decompression defoaming machine. However, this method was not suitable for high-viscosity resin that tended to be used for products under development, and had three major problems:
1. Variations easily occur in the manual mixing of resin, making uniform mixing difficult.
2. A decompression defoaming machine takes several tens of minutes to hours to defoam high-viscosity resin, adversely affecting efficiency.
3. A decompression defoaming machine needs to be manually switched between vacuum and air to break foam, so it is necessary to keep an eye on the machine for adjustment.
It was an urgent task for us to solve these problems in order to promote business.