Conductive materials
Silver paste
Used for IC chip bonding. It consists of silver particles and a binder. Because the ratio of silver is high, redispersion is necessary before use.
| Material | Silver paste |
|---|---|
| Capacity | 20ｇ |
| Unit | THINKY MIXER ARV-310 |
| Operation time setting | 2000rpm 30sec |
| Compounding ratio | 60wt％ |
| Material Viscosity | 150 Pa・s |
| Specific gravity | 2.5 |
Related data
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Before
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After
Supported products
THINKY MIXER （Vacuum） ARV-310P
・Simultaneous mixing, dispersion, and submicron-level air bubble elimination
・Deaeration of high-viscosity materials difficult to be processed by a centrifugal separator
・Reduced processing time and improved deareation performance compared to the atmospheric type mixer
・Centrifugal force of revolution prevents overflow of material during operation
・High-specific-weight materials such as fluorescent material can be evenly dispersed and deaerated without sedimentation (ARV-310LED)
・CE certified model is available
